TY  - JOUR
  - Han, Wei and Rensing, Marc and O'BRIEN, Peter and Peters, Frank H
  - 2011
  - January
  - Journal of electronic packaging
  - Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model
  - Validated
  - 133
  - 4
DA  - 2011/01
ER  - 

@article{V241769364,
   = {Han, Wei and Rensing, Marc and O'BRIEN, Peter and Peters, Frank H},
   = {2011},
   = {January},
   = {Journal of electronic packaging},
   = {Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model},
   = {Validated},
   = {133},
   = {4},
  source = {IRIS}
}