Development of three-dimensional passive components for power electronics

Typeset version

 

TY  - 
  - Thesis/Dissertation
  - P. Cantillon-Murphy
  - 2005
  - June
  - Development of three-dimensional passive components for power electronics
  - Author
  - Published
  - 0
  - ()
  - Thesis in partial fulfillment of the requirements for the degree of Master of Science in Computer Science and Engineering at MIT
  - As component and power densities have increased, printed circuit boards (PCBs) havetaken on additional functionality including heatsinking and forming constituent partsof electrical components. PCBs are not well suited to these tasks. A novel fabricationmethod is proposed to develop an enhanced circuit board fabrication approach whichovercomes this problem. This method uses a photoresistive scaffold and subsequentmetallization to realize the proposed structures. These structures are suitable asheatsinks, inductor windings, busbars and EMI shields among other applications.
  - Cambridge, Massachusetts
  - Massachusetts Institute of Technology
  - http://dspace.mit.edu/handle/1721.1/34679
DA  - 2005/06
ER  - 
@thesis{V73897522,
   = {Thesis/Dissertation},
   = {P. Cantillon-Murphy },
   = {2005},
   = {June},
   = {Development of three-dimensional passive components for power electronics},
   = {Author},
   = {Published},
   = {0},
   = {()},
   = {Thesis in partial fulfillment of the requirements for the degree of Master of Science in Computer Science and Engineering at MIT},
   = {{As component and power densities have increased, printed circuit boards (PCBs) havetaken on additional functionality including heatsinking and forming constituent partsof electrical components. PCBs are not well suited to these tasks. A novel fabricationmethod is proposed to develop an enhanced circuit board fabrication approach whichovercomes this problem. This method uses a photoresistive scaffold and subsequentmetallization to realize the proposed structures. These structures are suitable asheatsinks, inductor windings, busbars and EMI shields among other applications.}},
   = {Cambridge, Massachusetts},
   = {{Massachusetts Institute of Technology}},
   = {http://dspace.mit.edu/handle/1721.1/34679},
  source = {IRIS}
}
OTHER_PUB_TYPEThesis/Dissertation
AUTHORSP. Cantillon-Murphy
YEAR2005
MONTHJune
TITLEDevelopment of three-dimensional passive components for power electronics
RESEARCHER_ROLEAuthor
STATUSPublished
PEER_REVIEW0
TIMES_CITED()
SEARCH_KEYWORD
REFERENCEThesis in partial fulfillment of the requirements for the degree of Master of Science in Computer Science and Engineering at MIT
ABSTRACTAs component and power densities have increased, printed circuit boards (PCBs) havetaken on additional functionality including heatsinking and forming constituent partsof electrical components. PCBs are not well suited to these tasks. A novel fabricationmethod is proposed to develop an enhanced circuit board fabrication approach whichovercomes this problem. This method uses a photoresistive scaffold and subsequentmetallization to realize the proposed structures. These structures are suitable asheatsinks, inductor windings, busbars and EMI shields among other applications.
PUBLISHER_LOCATIONCambridge, Massachusetts
PUBLISHERMassachusetts Institute of Technology
EDITORS
ISBN_ISSN
EDITION
URLhttp://dspace.mit.edu/handle/1721.1/34679
START_PAGE
END_PAGE
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