IRIS publication 73897522
Development of three-dimensional passive components for power electronics
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TY - - Thesis/Dissertation - P. Cantillon-Murphy - 2005 - June - Development of three-dimensional passive components for power electronics - Author - Published - 0 - () - Thesis in partial fulfillment of the requirements for the degree of Master of Science in Computer Science and Engineering at MIT - As component and power densities have increased, printed circuit boards (PCBs) havetaken on additional functionality including heatsinking and forming constituent partsof electrical components. PCBs are not well suited to these tasks. A novel fabricationmethod is proposed to develop an enhanced circuit board fabrication approach whichovercomes this problem. This method uses a photoresistive scaffold and subsequentmetallization to realize the proposed structures. These structures are suitable asheatsinks, inductor windings, busbars and EMI shields among other applications. - Cambridge, Massachusetts - Massachusetts Institute of Technology - http://dspace.mit.edu/handle/1721.1/34679 DA - 2005/06 ER -
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@thesis{V73897522, = {Thesis/Dissertation}, = {P. Cantillon-Murphy }, = {2005}, = {June}, = {Development of three-dimensional passive components for power electronics}, = {Author}, = {Published}, = {0}, = {()}, = {Thesis in partial fulfillment of the requirements for the degree of Master of Science in Computer Science and Engineering at MIT}, = {{As component and power densities have increased, printed circuit boards (PCBs) havetaken on additional functionality including heatsinking and forming constituent partsof electrical components. PCBs are not well suited to these tasks. A novel fabricationmethod is proposed to develop an enhanced circuit board fabrication approach whichovercomes this problem. This method uses a photoresistive scaffold and subsequentmetallization to realize the proposed structures. These structures are suitable asheatsinks, inductor windings, busbars and EMI shields among other applications.}}, = {Cambridge, Massachusetts}, = {{Massachusetts Institute of Technology}}, = {http://dspace.mit.edu/handle/1721.1/34679}, source = {IRIS} }
Data as stored in IRIS
OTHER_PUB_TYPE | Thesis/Dissertation | ||
AUTHORS | P. Cantillon-Murphy | ||
YEAR | 2005 | ||
MONTH | June | ||
TITLE | Development of three-dimensional passive components for power electronics | ||
RESEARCHER_ROLE | Author | ||
STATUS | Published | ||
PEER_REVIEW | 0 | ||
TIMES_CITED | () | ||
SEARCH_KEYWORD | |||
REFERENCE | Thesis in partial fulfillment of the requirements for the degree of Master of Science in Computer Science and Engineering at MIT | ||
ABSTRACT | As component and power densities have increased, printed circuit boards (PCBs) havetaken on additional functionality including heatsinking and forming constituent partsof electrical components. PCBs are not well suited to these tasks. A novel fabricationmethod is proposed to develop an enhanced circuit board fabrication approach whichovercomes this problem. This method uses a photoresistive scaffold and subsequentmetallization to realize the proposed structures. These structures are suitable asheatsinks, inductor windings, busbars and EMI shields among other applications. | ||
PUBLISHER_LOCATION | Cambridge, Massachusetts | ||
PUBLISHER | Massachusetts Institute of Technology | ||
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URL | http://dspace.mit.edu/handle/1721.1/34679 | ||
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